Femtosecond laser micromachining solutions

many difficult-to-process materials in the biomedical, semiconductor microelectronics, aerospace and other industries provide a full range of extreme (extremely high precision, extremely small size, extremely large quantity, extremely fast efficiency) processing.

Laser film stripping

Femtosecond laser film stripping and removal

femtosecond laser film stripping is a precision, non-contact process that eliminates the risks of traditional mechanical stripping, such as substrate damage. By using a highly focused laser spot, it can selectively remove various coatings-including polymer insulating layers and oxide layers-while maintaining the original state of the underlying material. This technology is essential for electronics, semiconductors, medical devices and precision manufacturing.

Technical advantages

non-contact and injury-free: Eliminates mechanical wear and chemical contamination, ensuring the integrity of fragile substrates.
Micron-level accuracy: to achieve no damage removal, etching accuracy of ≤ ± 1 micron, depth control up to ≤ 0.1 microns.
Versatile compatibility: Adapt to complex geometries (flat, tubular and curved) and process a wide range of materials, including metals, polymers, ceramics and glass.
Efficient and scalable: Highly stable and repeatable, ideal for R & D prototyping and mass production.