Femtosecond laser micromachining solutions

many difficult-to-process materials in the biomedical, semiconductor microelectronics, aerospace and other industries provide a full range of extreme (extremely high precision, extremely small size, extremely large quantity, extremely fast efficiency) processing.

laser drilling
lasers naturally exhibit a gasian beam characteristic, which tends to naturally produce a cone shape due to the attenuation of the exit energy.

Through professional beam technology and process path optimization, we can achieve minimum taper in materials up to 2mm thick,

and precise machining of zero cone, positive cone and reverse cone, compatible with almost all materials, including metals, plastics and ceramics.

femtosecond laser drilling

Special Shaped Zero Taper Hole

inverse taper hole

microporous array drilling

array drilling opens hundreds to thousands of micropores in thin materials, which are widely used in various filtration scenarios: cell screens, liquid screens, printer inkjet boards, automobile injection nozzles, semiconductor silicon wafer stepping air filters, Aircraft oil filters, etc.

Femtosecond laser for ultra-high density, high quality screen processing