Femtosecond laser micromachining solutions

many difficult-to-process materials in the biomedical, semiconductor microelectronics, aerospace and other industries provide a full range of extreme (extremely high precision, extremely small size, extremely large quantity, extremely fast efficiency) processing.

laser cutting
different from traditional cutting technology, femtosecond laser cutting minimizes mechanical stress, reduces tool wear, and ensures that the cutting edge is clean and free of burrs. The cold ablation technology used in femtosecond laser cutting minimizes thermal effects, thereby avoiding material deformation, cracking and heat-related damage. The femtosecond laser ensures that the material absorbs energy only at the precise moment and location required-there is no excessive heating and no collateral damage.
This femtosecond laser cutting method is very suitable for processing fine materials or thin foils. It has a flexible cutting trajectory, which can achieve circular, linear and even complex patterns, providing a variety of possibilities for precise material removal.
The terms "drilling" and "cutting" are not always clearly defined. For example, a hole opened by a spiral cutting process is called a drill hole, but is actually formed by layer-by-layer cutting.

Mesh Cut Half Mono

Mesh Cutting-Mono

Mesh Precision Cutting Mono

Precision cutting with vertical cutting edge

in some high-end scenarios, parts require a high degree of compatibility to improve product performance, often requiring a specific cutting taper.

For example, when fabricating micron gaps in a mass spectrometer, zero taper is required, which significantly improves throughput without sacrificing resolution.